A Low-Temperature Creep Experiment Using Common Solder

This nine-page guide from Edmonds Community College provides a laboratory activity using lead-tin solder as a model material to demonstrate creep in metals. This activity "reinforces the concepts of stress and strain," and shows students the "role of stress in determining the creep rate in a metal alloy." After completing this activity, students will be able to "describe the effects of defects on material properties." The guide includes step-by-step instructions for educators to set up specimens for use in the demonstration. The activity spans one week of class time in 11th grade, 12th grade, and introductory college courses.

This guide includes the following sections: Student Learning Objectives, MatEd Core Competencies Covered, Equipment and Supplies Required, Curriculum Overview, Module Procedure, and an Evaluation Packet.